Leaked Specs Reveal a Much-Improved HMD Fusion Smartphone for the European Market

HMD is preparing to launch a significantly upgraded European version of its modular Fusion smartphone, addressing the original model’s primary hardware shortcomings while retaining its highly customizable accessory ecosystem.

According to reliable leaker smashx_60, the European Fusion swaps the entry-level Snapdragon 4 Gen 2 for the substantially more capable Qualcomm Snapdragon 7s Gen 2 processor. Memory configurations are also receiving a boost, offering 8GB or 12GB of RAM—complete with virtual RAM expansion—paired with a standard 256GB of internal storage.

The display sees a major generational leap, moving from a basic HD+ 90Hz panel to a sharper 6.56-inch FHD+ IPS LCD with a smooth 120Hz refresh rate. While the camera hardware remains largely familiar, the 108-megapixel primary sensor is now reportedly equipped with optical image stabilization (OIS) for better low-light performance and sharper images. The module is rounded out by a 2-megapixel secondary rear lens and a 50-megapixel front-facing camera. Power is supplied by a 5,000mAh battery supporting 33W fast charging, and the device will reportedly launch with a strong four-year software update guarantee.

The original Fusion debuted in September 2024, standing out in the budget market for its high repairability and interchangeable “Outfits.” These modular accessories connect via a rear-mounted Smart Pin, adding functional hardware features like wireless charging, built-in ring lights, or heavy-duty protection. HMD even provides an open-source development kit, allowing enthusiasts to design and 3D-print their own custom cases.

By upgrading the core processor and display, HMD is reinforcing its vision of a highly adaptable smartphone without the performance compromises that hindered the first-generation release. If these leaked specifications prove accurate, the European Fusion refresh promises a significantly sharper and more responsive daily experience.