China’s SMIC Achieves 5nm Chip Breakthrough

In a significant development that could shift the global semiconductor landscape, China’s Semiconductor Manufacturing International Corporation (SMIC) has reportedly succeeded in manufacturing 5nm chips without relying on extreme ultraviolet (EUV) lithography.

Instead of using EUV, which is exclusively produced by Dutch company ASML and heavily restricted by Western export controls, SMIC employed older deep ultraviolet (DUV) equipment combined with a sophisticated technique known as Self-Aligned Quadruple Patterning (SAQP). This complex process allows for the kind of ultra-fine patterning typically reserved for EUV-based production.

The news, shared by semiconductor analyst William Huo on X (formerly Twitter), underscores both a technological and geopolitical milestone. For years, it was widely believed that progress below the 7nm node would be impossible without EUV systems. Yet, SMIC has demonstrated otherwise, using multiple layers of DUV patterning and etching to replicate the precision required for advanced chips.

While this approach is more time-consuming, costly, and prone to errors compared to EUV, the end result is functional: a 5nm-class chip. Reports suggest this chip is already powering devices such as the Huawei Mate 60 with the Kirin 9000S — a smartphone that notably beat Apple’s iPhone 15 in launching satellite call capabilities.

This breakthrough not only highlights China’s determination to advance its semiconductor capabilities amid global restrictions, but also sets a precedent for innovation under pressure.