Leaked Redmi Prototype Features Dimensity 9500 and Active Cooling Fan with IP68 Rating
The landscape of high-performance smartphones is undergoing a significant shift in thermal management strategies. According to new intelligence from the prominent technology insider Digital Chat Station, a sub-brand performance flagship—likely under the Redmi umbrella—is currently testing a prototype that integrates active cooling hardware without sacrificing environmental durability.
The engineering prototype in question is reportedly powered by the unannounced MediaTek Dimensity 9500 chipset. However, the standout feature is not merely the silicon, but the thermal solution accompanying it. The leak indicates that the device features an internal active cooling fan embedded directly within the “Deco” section, or the camera module, of the smartphone.
Historically, the inclusion of physical cooling fans in smartphones, a feature seen primarily in niche gaming devices, has necessitated air vents that compromise water and dust resistance. This new device appears to have overcome that engineering hurdle. The report states that despite the mechanical complexity of the internal fan, the phone will support an IP68 rating, ensuring high-level protection against water submersion and dust ingress.
Active Cooling Fan and IP68
Beyond the internal mechanics, the leak sheds light on the display and design philosophy of the upcoming handset. The device is expected to feature a flat screen with a 1.5K resolution, a specification chosen to balance visual clarity with power efficiency. Furthermore, it will support ultra-high refresh rates, catering to gamers who demand fluid interface interactions. Aesthetically, the phone is described as having a minimalist ID design, suggesting a sleek exterior that belies the complex cooling system within.
This development highlights a broader industry trend where active cooling systems are migrating from specialized gaming phones to mainstream performance flagships. As mobile processors like the Dimensity 9500 continue to push the boundaries of raw processing power, thermal throttling remains the primary bottleneck for sustained performance. Consequently, manufacturers are adopting more aggressive cooling solutions.
The market context supports this shift. Honor recently introduced its WIN series featuring “Dongfeng Turbo Cooling,” which utilizes a high-speed internal fan. Similarly, iQOO is preparing to launch the iQOO 15 Ultra ahead of the Lunar New Year, which is rumored to feature a large active cooling fan and physical shoulder buttons. If the reports regarding this new Redmi device hold true, the combination of active cooling and IP68 certification could set a new benchmark for performance smartphones in 2026.
