REDMI K90 Leak Reveals 50MP Triple Camera and Premium Build
A REDMI K90 Leak suggests a very exciting series of upcoming phones. Xiaomi is gearing up to expand its flagship portfolio with the forthcoming REDMI K90 series, which, according to recent industry leaks, will feature a sophisticated 50MP triple-camera system and premium build refinements aimed squarely at the high-end smartphone market.
REDMI K90 Leak: Advanced Triple-Camera Setup
The REDMI K90 Android phones will debut an upgraded 50MP triple-camera array. Leveraging an integrated cold-carved glass process, Xiaomi has merged the oversized matrix camera module seamlessly into the rear panel, using a color-matched transparent design. This method not only improves durability but also delivers a sleek, minimalist aesthetic in line with current flagship design trends.
Premium Materials and Build Quality
Significant construction enhancements are expected across the K90 lineup, including:
-
Matte finish for improved grip and premium feel
-
Reinforced metal middle frame for durability
-
Cold-carved glass integration for a seamless rear design
-
Finer textures and craftsmanship for a more refined look
These refinements emphasize Xiaomi’s intent to compete more aggressively in the premium device segment, where both appearance and build quality play a critical role in consumer choice.
Display and Form Factor
Despite speculation about a possible shift to other display technologies, Xiaomi is retaining LTPS (Low Temperature Polycrystalline Silicon) panels for the K90 series, citing their proven efficiency and strong performance in flagship-grade devices.
The new series will also adopt a larger form factor, reflecting the industry-wide demand for expansive screens optimized for immersive media consumption and gaming.
A Step Beyond the K80 Pro
Launched in November 2024, the REDMI K80 Pro offered a 50MP main sensor (1/1.55” size), a 32MP ultra-wide camera, and a 50MP floating telephoto lens with OIS and 20x super zoom. The K90 series builds on this foundation, offering further hardware refinements, more advanced integration techniques, and a more premium fit and finish.
